- 28 Apr 2010:Net income for the first quarter of 2010 was US$27.5 million, compared to net losses of US$51.1 million a year ago. "We were pleased with the successful ramp into high volume of new technologies such as embedded wafer-level ball-grid array (eWLB) and the continued growth of our business in advanced technologies such as hybrid flip-chip and wafer level packaging..."
- 27 Apr 2010:
- 18 Mar 2010:"Asia is a very strategic region for Spansion in the fast growing embedded electronics markets," said John Kispert, president and CEO of Spansion. "With the addition of SL Chan, we have strengthened our team with a veteran sales and marketing executive who will be a key asset for the company's new business strategy..."
- 18 Jan 2010:Spansion has reported net sales of US$307.1 million for the fourth quarter of 2009, which marked its second consecutive profitable quarter with net income on a US GAAP basis of US$4.3 million.
- 15 Jan 2010:Intel may look to acquire an FPGA supplier such as Xilinx or Altera in 2010 in an effort to expand its presence in the embedded market as well as SoCs, according to a Wall Street analyst.
- 24 Sep 2009:The Numonyx eMMC architecture is comprised of an embedded storage solution with multi-media card interface, flash memory device and host controller íV all in a small BGA package. With interface speeds of up to 52MB per second, Numonyx eMMC also allows for an interface voltage of either 1.8V or 3.3V.
- SMIC selects Virage Logic embedded multi-time programmable NVM for RFID applications (Sep 23) - Company releaseVirage Logic and SMIC have jointly announced a RFID optimized version of Virage Logic's AEON multi-time programmable non-volatile memory (NVM) solution. The RFID-optimized NVM solution, ideal for use in passive tags, is being developed on SMIC's 180nm low leakage process.
- 21 Sep 2009:The IBM eDRAM in 32nm SOI technology is the fastest embedded memory announced to date, achieving latency and cycle times of less than 2 nanoseconds.
- 12 Aug 2009:China-based foundry Grace Semiconductor Manufacturing has announced the successful development of its 0.13-micron embedded flash process.
- 29 Jul 2009:Globalfoundries plans to introduce embedded silicon carbon (eSiC) to strain the nFET transistors at the 22 nm node, said John Pellerin, director of technology development.
- 20 May 2009:Globalfoundries has announced a joint development agreement with T-RAM, as part of which the two firms will bring T-RAM's Thyristor-RAM embedded memory technology to "advanced technology nodes."
- 19 May 2009:A number of efforts to leverage Google's "Android," software for Google's open source project for mobile phones and other home information appliances, were introduced at the 12th Embedded Systems Expo.
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