Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

The text is available free of charge for three days after publish date; older interviews require membership.

Please contact us if you're interested in arranging an interview.

Displaying interviews tagged IC design, distribution [back to index]

Gearing up for 28nm FPGA: Q&A with Altera CEO John Daane

Monday 2 March 2009

Expanding through acquisitions: Q&A with STMicro CEO Carlo Bozotti

Wednesday 4 February 2009

Learning from Taiwan IC industry's marketing sensitivity: Q&A with China-based VeriSilicon CEO Wayne Dai

Monday 15 December 2008

Efficiency, differentiation, time-to-market and localized service are keys to probe card success: Q&A with FormFactor CEO Mario Ruscev

Thursday 27 November 2008

Staying focused on wireless connectivity: Q&A with CSR CEO Joep van Beurden

Wednesday 26 November 2008

MEMS mass production to lead to increased foundry outsourcing: Q&A with Siimpel CEO Chee Kwan

Monday 20 October 2008

ARM-based MID products to hit the market in 2009: Q&A with Warren East, CEO of ARM

Tuesday 30 September 2008

Economic takes its spot next to technology: Talking techonomics with Synopsys CEO Aart de Geus

Friday 12 September 2008

The state of the semiconductor industry: Q&A with SEMI president Stanley Myers

Thursday 11 September 2008

If you can be number one in China you can be number one in the world: Q&A with Freescale senior VP Henri Richard

Friday 18 July 2008

From Hollywood to your digital life: Q&A with Dolby marketing vice president Francois Modarresse

Wednesday 25 June 2008

Trends in storage, the economy and network: Comments from LSI CEO Abhi Talwalkar

Monday 9 June 2008

Trends in the Wi-Fi industry: An interview with Michael Hurlson of Broadcom

Monday 9 June 2008

Well-positioned for an audio IC boom: Q&A with Wolfson CEO Dave Shrigley

Friday 16 May 2008

From ASIC to CSSP: Q&A with QuickLogic Greater China sales director David Kuo

Monday 12 May 2008

Handset demand growth in China promising: Q&A with NXP Greater China VP Stephen Lin

Thursday 27 March 2008

Merger as key to growth: Q&A with GM of analog IC design house GMT

Tuesday 18 March 2008

Silicon Laboratories expects strong growth in MCU business this year: Q&A with VP Derrell Coker

Friday 14 March 2008

Snowstorms spur communications infrastructure demand in China: Q&A with Frank Liang, general manager of Greater China at Broadcom

Thursday 13 March 2008

Enhanced user experience at core of handset solution: Q&A with TI senior VP of wireless terminals business unit, Greg Delagi

Tuesday 26 February 2008

Configurability, differentiation and margin: Q&A with ARC CEO Carl Schlachte

Friday 22 February 2008

Braving the storm in the NAND flash market: Q&A with 3S general manager Hu Ting-chung

Tuesday 25 December 2007

Aiming high: Q&A with Mike Yeh, NXP regional executive for Greater China

Tuesday 20 November 2007
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