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15 Sep 2003: | Upturn to strengthen next year Although no “killer apps” have emerged and uncertainty about the sustainability of this recovery remains, an upturn has begun that will strengthen in 2004 and 2005, said Archie Hwang, chairman and CEO of Hermes-Epitek, SEMI BOD member and chairman of the Taiwan Regional Advisory Board, at the SEMICON Taiwan 2003 press conference on Friday.
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| MEMS, III-V technology in the spotlight at SEMICON Taiwan 2003 SEMICON Taiwan 2003 will highlight two exciting and emerging technology areas: MEMS (micro-electromechanical systems) and III-V semiconductors.
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| Semiconductor outlook positive on higher demand and cautious capital spending While widespread sentiment is mixed for a near-term recovery in the semiconductor industry, positive signs are beginning to appear.
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| FEI Company finds focus in nanotech as smaller features drive development In the world of semiconductors, size continues to play a critical role as customers continue to clamor for smaller and smaller features. Like its competitors, FEI Company is working with its customers to help them get to the next level – smaller features with more capabilities.
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| Superhighway now open! Faster than ever before – integrated solutions from IC design to manufacturing At SEMICON Taiwan, Spirox will take customers on a tour of a new “Superhighway.” David Sheu, Spirox chairman and CEO, explains more.
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| Taiwan semiconductor manufacturing industry upgrading its technology Taiwan’s IC industry grew 12% year-on-year to produce NT$348.5 billion worth of products in the first half of 2003, according to the Industrial Technology Information Service (ITIS). Taiwanese semiconductor manufacturing companies are investing to upgrade technology to improve earnings and widen their lead over worldwide competitors.
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16 Sep 2003: | Blue skies reflect industry sentiment at opening of Semicon Taiwan 2003 Semicon Taiwan 2003 opened yesterday at 10 am. Blue skies greeted the record number of participants and seemed to reflect the mood of the lines of attendees waiting to register. The few white clouds and the weather forecast for rain in the afternoon reflected the ever-present question of “has the recovery begun and is now the right time to pick up capital spending?” Any potential rain may not be noticed, given the range of events laid on in the Taipei International Convention Center (TICC) and the exhibition going through Wednesday in the Taipei World Trade Center (TWTC).
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| Gartner: Worldwide flash card market to grow 38% in 2003 Despite declining NAND flash memory component prices in the first half of this year, the worldwide flash card market is poised for strong revenue growth in 2003, market research firm Gartner announced on September 11. The worldwide flash card market is forecast to reach US$2.75 billion in 2003, a 38% increase over 2002. In 2002, worldwide flash card revenue totaled US$1.99 billion.
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| Taiwan packaging and testing providers enjoy record August sales Taiwan-based IC packaging and testing service providers enjoyed strong sales in August. Nine companies set record highs, and four others posted highs for this year.
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| Semiconductor industry capital spending set to rise Semiconductor capital expenditures are tightly linked to the recovery of the entire industry. There is a direct knock-on effect from an increase in demand for semiconductors to the need for extra capacity at wafer fabs and thus increased capital expenditures – investment only begins to rebound when strong potential growth is expected. As the third quarter has unfolded, more and more substance seems to have formed behind the signs of recovery in the semiconductor industry and the major players have already allocated major budgets to support the perceived growth potential of the next six months. Current forecasts put 2003 capital spending at about 9% more than in 2002.
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| Entegris cleans up in materials integrity management Cleanliness remains a key to successful manufacturing in the semiconductor arena and a key force for profitability for Chaska, Minn.-based Entegris. The company grew 30% in its 2003 fiscal third quarter (ended May 31) with revenues of US$70 million, compared to US$54 million for the previous quarter. According to president and CEO, Jim Dauwalter, around 80% of Entegris’s revenue is derived from semiconductor products and services.
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| Unaxis keeps focus on customers and integration in deposition and etching Building on a long history in advanced manufacturing technologies and processes, Unaxis Semiconductors, a US subsidiary of the Swiss company Unaxis, is taking an integrated, customer-oriented approach to semiconductor production that is giving the company an edge on its competitors during these lean times.
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| Semiconductor industry in China enacting a great leap forward The combination of increasing foreign and domestic investment with a strategy shift towards foundry services has helped the semiconductor manufacturing industry in China establish itself on the semiconductor atlas. With the local industry poised to enter 12-inch production in 2004, it has come a long way since its start 20 years ago.
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17 Sep 2003: | Amkor: Outsourced IC packaging and testing to double in three years The global market for outsourced IC packaging and testing is likely to balloon to US$10.5 billion in 2005 from US$5.7 billion in 2002, as packaging and testing costs rise as a proportion of total production costs and demand for advanced packaging services increases, said Bruce Freyman, executive vice president of operations at Amkor Technology.
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| Semiconductors set for double-digit growth in 2004; DRAM chips to lead the recovery The increasingly diverse applications for semiconductors – growing from a focus on to encompass many consumer products – will induce robust, double digit growth for the industry in 2004. DRAM chips will be the shining star among the broadening variety of products.
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| Connecting ICs to the outside world, scientifically, ethically and with the environment in mind Taiwan, situated at the center of the Asia-Pacific region, enjoys a tremendous geographical advantage over its neighbors. With its complete electronics supply chain and the world’s two largest foundries, the island is well positioned as a regional operations center.
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| Overview of new packaging technologies Demand from end-user application markets drives the development of new packaging technologies. For instance, mobile phones drove the development of stack packaging and PCs and game consoles that of flip chip packaging. Similarly, the rise of DRAM transmission speeds and improvements in wafer process technology will lead flip chip chip scale packaging (FC CSP) to become the main packaging technology for DRAM. In opto-electronics, specialized ICs such as those used in MEMS and DWD are also demanding innovations in packaging technology
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| Testing and packaging, the mainstay of China’s semiconductor industry The testing and packaging industry represents a significant portion of the semiconductor industry in China. According to the China Center for Information Industry Development (CCID), 60% of the 2002 total production value of China’s semiconductor industry came from the testing and packaging sector. The center’s figures also showed that of the top 10 IC companies in China in 2002, five were testing and packaging firms while three were IDMs.
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Company
showcase: | Entegris Pressure transducer
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| FEI Company Dual-beam analysis
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| Spirox Spirox provides integrated solutions from IC design through manufacturing for the semiconductor and TFT LCD high-tech industries. Please visit Spirox’s booth to experience our best practice solutions.
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| Unaxis Versaline
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