Taiflex Scientific, a specialist in flexible PCB materials such as flexible copper clad laminates (FCCL), celebrated the grand opening of its Thailand plant on May 15 at the Amata City Chonburi Industrial Estate.
Advanced Technologies & Solutions (AT&S), an Austria-based PCB and IC substrate manufacturer, has announced plans to sell its plant in Ansan, South Korea, which largely services the medical industry.
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also increased significantly, and communication between chips is a key factor in processing speed.
Chin-Poon Industrial, which has a strong production focus on automotive PCBs, has revealed plans to invest an additional THB1 billion (US$27.3 million) in expanding its factory site in Thailand.
Recently, Sravan Vanaparthy, Vice President of Industrial Power Division, Power Solutions Group (PSG) at On Semiconductor (Onsemi), had an exclusive interview with DIGITIMES Research to share Onsemi's views on the current development of SiC power semiconductors, as well as the trends and prospects of SiC power semiconductors next year and in the next 5 to 10 years.
Taiwan Printed Circuit Association (TPCA) convened an investment exchange summit for the electronics manufacturing industries in Thailand on May 2nd. During the assembly, Mr. Lawrence Chang, Chairman of TPCA Thailand PCB Sodality (also Vice Chairman of TPCA), underscored the advent of a transformative industrial landscape amid the backdrop of the U.S.-China trade war and geopolitical intricacies.
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing (HPC).
Introspect Technology, a Canadian private company, introduced its M5512 GDDR7 Memory Test System, which is designed for testing GDDR7 memory controllers, GDDR7 physical layers, and GDDR7 SGRAM chips, less than one month after the graphics memory specification was announced in March 2024.
Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of a glass substrate trial production line by one quarter, aiming to stay competitive in the semiconductor materials market.
The explosive growth in Generative AI (GenAI) business opportunities spurred by ChatGPT drives the demand for hardware and software related to the GenAI supply chain. TSMC, the sole supplier of AI chips for Nvidia and other vendors, is also bolstering its supply chain partners with recent capacity expansions.
The US will triple its domestic semiconductor manufacturing capacity from 2022—when the CHIPS and Science Act (CHIPS) was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time, according to a recent SIA report.
Compared to TSMC, Samsung Electronics, and even Intel Foundry, which have moved into sub-7nm advanced processes, GlobalFoundries (GF), which announced in August 2018 that it would indefinitely shelve its sub-7nm development, still has a chance to enter the AI market pie. Is there still a chance for GF to get a piece of the AI market pie?
Taiwan-Asia Semiconductor Corporation (TASC), in its transition from optoelectronic sensing, reported a post-tax loss of NT$38 million in the first quarter of 2024.
MLCC manufacturer Murata Manufacturing Co., Ltd. stated that demand for components in smartphones is recovering, and there is also expected growth in demand related to automotive electrification. Therefore, Murata anticipates an increase in revenue and profit margin for the fiscal year 2024 (April 2024 to March 2025).
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale of 90% equity in its China subsidiary Jinglong Technology (Suzhou) for approximately CNY48.85 billion (about US$675 million).
Imec.xpand, an independent global venture capital fund, today announced the launch of a new EUR 300 million fund aimed at accelerating the growth of transformative semiconductor and nanotechnology innovations.
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly specialized field to gain their entry into the high-margin market of advanced chips and Chiplet.
Against the backdrop of a secular slowdown in economic growth and a real-estate bubble burst that added debt burdens, how much longer can China continue to subsidize its industries and realize the dream of building a self-sufficient semiconductor supply chain?
EISO, the PCB factory, participated in the Satellite 2024 Conference & Exhibition held in Washington DC, USA for the first time, marking the company's entry into Low-Earth Orbit (LEO) satellite applications. This shows EISO's shift of focus to a high-end application of PCB technology, aside from their continuing efforts on domestic and international markets for electric-assisted bicycles (e-bikes).
Taiwan-based suppliers of III-V compound semiconductors, PCBs, and other IC components are divided on demand forecasts for new iPhones and other Apple devices, according to industry sources.
Many Chinese semiconductor firms have told customers they are raising prices due to rising costs of precious metals, such as gold and copper, according to industry sources.
