An explosion from a chemical truck at Taiwan Semiconductor Manufacturing Co.'s construction site in Arizona killed the driver, according to statements from a local construction union and the Phoenix Police Department.
Amazon participated in the private placement for SIP Core provider Alchip, purchasing around a 0.3% share in Alchip for US$16 million. Regarding this move, Bloomberg Opinion columnist Tim Culpan wrote on LinkedIn that in the current era of the AI development boom, having independent chip R&D capabilities is a major advantage in differentiating one's competitiveness.
To maintain its leading position in Artificial Intelligence (AI), Nvidia has mastered its CUDA software, constantly emphasized its affiliation with Taiwan and TSMC, and has even secured strong connections with the server supply chain in practice.
Amidst endeavors to cultivate a semiconductor ecosystem, India is purportedly contemplating creating an IP pool for semiconductor startups, mirroring the approach adopted by Taiwan in nurturing its semiconductor ecosystem.
Veolia Water Technologies, a subsidiary of Veolia and a leading specialist in water treatment technologies and services, announces on May 15 the inauguration of its first ion exchange regeneration facility in China. The facility features state-of-the-art technology to efficiently recycle spent ion exchange resins, promoting resource optimization and sustainability.
Taiwan-based companies engaged in fab engineering services and construction, including United Information Systems (UIS), Yankey Engineering, Acter, Marketech International, and Trusval Technology, have enjoyed brisk orders from TSMC and other chipmakers, according to industry sources.
The US announced 25% to 100% tariff hikes on China-made EVs, batteries, semiconductors and other goods. Although the move does not impact South Korean industries for now, companies must tackle a new round of supply chain disruptions as US-China trade disputes heat up.
While governments in the US, Europe, India, and Japan are eager to strengthen domestic semiconductor supply chains with subsidies, Taiwan sees its irreplaceable role in helping global teams actualize their innovation faster than building fabs from scratch.
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also increased significantly, and communication between chips is a key factor in processing speed.
Broadcom anticipates that AI chip revenue will contribute 35% to its semiconductor revenue in 2024, up sharply from 15% in 2023. The AI revenue for the year is estimated to soar past US$10 billion, more than double the 2023 level of US$4.3 billion.
Taiwan's National Science and Technology Council (NSTC) announced the launch of the "IC Taiwan Grand Challenge" on May 14 to attract global IC-related teams to Taiwan to propose research, development, and commercialization plans and leverage the semiconductor ecosystem and capabilities.
The South Korean government is planning a comprehensive semiconductor investment support program, with a scale exceeding KRW10 trillion (US$7.304 billion). The aim is to strengthen South Korea's position in the semiconductor industry.
Samsung Electronics and SK Hynix recently disclosed the orders and development of their High-Bandwidth Memory (HBM) products and have released optimistic comments for standard DRAM and HBM prices.
Recently, Sravan Vanaparthy, Vice President of Industrial Power Division, Power Solutions Group (PSG) at On Semiconductor (Onsemi), had an exclusive interview with DIGITIMES Research to share Onsemi's views on the current development of SiC power semiconductors, as well as the trends and prospects of SiC power semiconductors next year and in the next 5 to 10 years.
Polar Semiconductor, the only US-based manufacturer specializing in sensor, power, and high-voltage semiconductors, disclosed plans to expand its Bloomington, Minnesota manufacturing facility and branch into innovative technologies to serve new customers and markets.
India's US$10 billion semiconductor mission is surging forward with recent collaborations and investments. The partnership between Power Semiconductor Manufacturing Corporation (PSMC) and Tata, along with Micron's substantial investments, signal decisive strides in fortifying India's semiconductor industry.
Intel has announced the appointment of Kevin O'Buckley as senior VP and GM of Foundry Services, the customer service and ecosystem operations division of Intel Foundry. O'Buckley starts immediately and joins Intel's executive leadership team, reporting to CEO Pat Gelsinger.
Huawei has recently launched its Pura 70 series smartphones featuring its in-house developed Kirin 9010 application processors made using SMIC's 7nm N+2 manufacturing process.
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
The newly-elected governor of Kumamoto Prefecture said he's ready to ensure wide-ranging support to woo Taiwan Semiconductor Manufacturing Co. to build its third Japanese chip factory there.
Micron Technology announced to invest in engineering and operation centers in Mexico on May 10 that it will hire at least 100 workers by the end of 2024.
Leading IC packaging and testing company, ASE Technology Holding Co., Ltd. reported a revenue of NT$45.82 billion for April, showing a monthly increase of 0.3% and a year-on-year increase of 5.8%. Among them, revenue from Packaging, Testing, and Materials (ATM) was approximately NT$25.19 billion, a decrease of 2.1% compared to the previous month but an increase of 8% compared to the same period last year.
