Recently, Sravan Vanaparthy, Vice President of Industrial Power Division, Power Solutions Group (PSG) at On Semiconductor (Onsemi), had an exclusive interview with DIGITIMES Research to share Onsemi's views on the current development of SiC power semiconductors, as well as the trends and prospects of SiC power semiconductors next year and in the next 5 to 10 years.
Introspect Technology, a Canadian private company, introduced its M5512 GDDR7 Memory Test System, which is designed for testing GDDR7 memory controllers, GDDR7 physical layers, and GDDR7 SGRAM chips, less than one month after the graphics memory specification was announced in March 2024.
In 2000, Bill Gates visited Taiwan for the World Congress of Information Technology (WCIT), and in 2009, Steve Ballmer, the second president of Microsoft, visited Taiwan only for one day. These were the only two times that the CEOs of Microsoft visited Taiwan.
Compared to TSMC, Samsung Electronics, and even Intel Foundry, which have moved into sub-7nm advanced processes, GlobalFoundries (GF), which announced in August 2018 that it would indefinitely shelve its sub-7nm development, still has a chance to enter the AI market pie. Is there still a chance for GF to get a piece of the AI market pie?
Since the official shipment of the extreme ultraviolet (EUV) lithography machine in 2017, ASML has sold about 200 units of EUV equipment, critical to manufacturing advanced chips.
As expected, Apple's late product announcement on May 7 included new iPad Pros powered by the M4 processor and a new Apple Pencil Pro. With these new gadgets now official, industry watchers are monitoring the share of production and projected sales numbers for each iPad model and supply chain coordination. In addition, attention is also on Apple's efforts in foldable smartphones and tablets.
In an exclusive video interview with DIGITIMES Asia managing editor Judy Lin (JL), Marc Hijink (MH), the acclaimed Dutch journalist and author of "Focus - the ASML Way," during his visit to Taipei, Taiwan, delves into the intricate world of ASML, a global leader in semiconductor lithography machines.
The most unexpected development in Qisda's history occurred in 2005, when the company's predecessor, BenQ, failed to merge with Siemens Mobile. It made a large loss of NT$30 billion (US$927.4 million) at the time. For the industry, BenQ's failure to integrate Siemens Mobile remains a lethal mergers and acquisitions lesson.
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly specialized field to gain their entry into the high-margin market of advanced chips and Chiplet.
Against the backdrop of a secular slowdown in economic growth and a real-estate bubble burst that added debt burdens, how much longer can China continue to subsidize its industries and realize the dream of building a self-sufficient semiconductor supply chain?
Recently a Delaware-based non-profit media Rest of World interview roused widespread attention and discussion regarding TSMC's Asian management model and hierarchy system.
