Introspect Technology, a Canadian private company, introduced its M5512 GDDR7 Memory Test System, which is designed for testing GDDR7 memory controllers, GDDR7 physical layers, and GDDR7 SGRAM chips, less than one month after the graphics memory specification was announced in March 2024.
Taiwan's recent efforts to build its own "Starlink" have received growing attention as satellite communication has proven itself inalienable to wartime resilience, but to what degree are the ongoing government-backed satellite programs geared for modern warfare?
Recently, Sravan Vanaparthy, Vice President of Industrial Power Division, Power Solutions Group (PSG) at On Semiconductor (Onsemi), had an exclusive interview with DIGITIMES Research to share Onsemi's views on the current development of SiC power semiconductors, as well as the trends and prospects of SiC power semiconductors next year and in the next 5 to 10 years.
As expected, Apple's late product announcement on May 7 included new iPad Pros powered by the M4 processor and a new Apple Pencil Pro. With these new gadgets now official, industry watchers are monitoring the share of production and projected sales numbers for each iPad model and supply chain coordination. In addition, attention is also on Apple's efforts in foldable smartphones and tablets.
In an exclusive video interview with DIGITIMES Asia managing editor Judy Lin (JL), Marc Hijink (MH), the acclaimed Dutch journalist and author of "Focus - the ASML Way," during his visit to Taipei, Taiwan, delves into the intricate world of ASML, a global leader in semiconductor lithography machines.
The most unexpected development in Qisda's history occurred in 2005, when the company's predecessor, BenQ, failed to merge with Siemens Mobile. It made a large loss of NT$30 billion (US$927.4 million) at the time. For the industry, BenQ's failure to integrate Siemens Mobile remains a lethal mergers and acquisitions lesson.
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly specialized field to gain their entry into the high-margin market of advanced chips and Chiplet.
Against the backdrop of a secular slowdown in economic growth and a real-estate bubble burst that added debt burdens, how much longer can China continue to subsidize its industries and realize the dream of building a self-sufficient semiconductor supply chain?
Recently a Delaware-based non-profit media Rest of World interview roused widespread attention and discussion regarding TSMC's Asian management model and hierarchy system.
As the US-China technology war enters its seventh year, with the process of domestic substitution policy of China's semiconductor industry continuing to deepen, China's local Electronic Design Automation (EDA) software products have made considerable progress in recent years and accelerated their development to bridge the 15 years gap with their American and European rivals.
Although US sanctions have significantly slowed down the development of China's semiconductor industry towards the advanced nodes, it is not the time to be content that China is lagging behind the US in semiconductor technologies.
The Taiwan Chip-driven Industrial Innovation Program (TCIIP) has taken a significant step by establishing an office in Prague, Czech Republic, focusing on nurturing chip design talent and attracting IC startups.
Samsung Electronics and SK Hynix are accelerating their investment pace in the US, and are collaborating with universities near factory sites to ensure a steady supply of semiconductor talent.