NXP Semiconductors and Pegatron have announced plans to open a joint laboratory and work together on various automotive electronics applications. Their early partnership will concentrate on applications that can be implemented quickly, starting with smart cockpits.
Recently, Sravan Vanaparthy, Vice President of Industrial Power Division, Power Solutions Group (PSG) at On Semiconductor (Onsemi), had an exclusive interview with DIGITIMES Research to share Onsemi's views on the current development of SiC power semiconductors, as well as the trends and prospects of SiC power semiconductors next year and in the next 5 to 10 years.
Introspect Technology, a Canadian private company, introduced its M5512 GDDR7 Memory Test System, which is designed for testing GDDR7 memory controllers, GDDR7 physical layers, and GDDR7 SGRAM chips, less than one month after the graphics memory specification was announced in March 2024.
Infineon Technologies will supply Silicon Carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and bare die products to Xiaomi's EVs, including the recently announced SU7, until 2027, according to the Germany-based chipmaker.
Taiwan-based IC design houses are generally bullish about their market prospects for the second half of 2024, notwithstanding the persistently unfavorable macroeconomic climate, according to industry sources.
Qualcomm reported slightly stronger-than-expected results over the past quarter, and its upbeat outlook suggests an improvement in the mobile phone industry. Qualcomm also expects the automotive business to play a larger role.
Samsung Electronics has been ramping up its power semiconductor development team and is considering expanding its production capacity. This move aims to meet the anticipated surge in demand for power chips driven by the rise of Artificial Intelligence (AI) and Electric Vehicles (EVs).
Flexible printed circuit (FPC) specialist Flexium Interconnect has expressed optimism about demand for automotive applications in the long run, believing the worst has passed.
Japan-based semiconductor company Renesas released its financial results for the first quarter of 2024 on April 25. The company experienced a limited profit decline and expected the weaker performance to continue in the second quarter.
Horizon Robotics has showcased its next-generation automotive processor, the Journey 6 series, which will power BYD's forthcoming New Energy Vehicles (NEV).
Tesla Inc. Chief Executive Officer Elon Musk couldn't have been more clear in his message to investors: Tesla is now an artificial intelligence company.
Chang Wah Technology (CWTC), a major supplier of IC lead frames, held its earnings call on April 23 in conjunction with its parent company Chang Wah Electromaterials (CWE), during which CWTC manager Su Shuang-Fu noted that the company is prepared to seize the initiative as the market recovers, as signs of a rebound in demand have been appearing since the second half of 2023.
Key semiconductor material distributor Chang Wah Electromaterials (CWE) has announced new pricing for epoxy molding compounds effective from the third quarter of 2024, due to a weak Japanese Yen.
TSMC offered its take on market developments at its quarterly earnings call on April 18: while demand for AI-related high-performance computing (HPC) continues to grow, the same cannot be said for other applications.
Leading automotive IDMs are facing increasing competition, with STMicroelectronics (ST) trailing closely behind second-placed NXP Semiconductors, according to TechInsights.
LG Innotek and the automotive electronics division of LG Electronics recently visited Hyundai Motor Group's R&D hub. The industry has been wondering whether the two sides will expand their collaboration in the car sector.
Ahead of a meeting between Tesla CEO Elon Musk and Indian Prime Minister Narendra Modi, it is reported that Tesla is talking with Tata Electronics for chip supply and is looking to rely on local component suppliers rather than international electronics majors to build an EV ecosystem.
Infineon Technologies recently announced a multi-year partnership with Amkor Technology, a leading provider of semiconductor packaging and test services. Both companies have agreed on operating a dedicated packaging and test center at Amkor's manufacturing site in Porto, with operations set to commence in the first half of 2025.
The Advanced SoC Research for Automotive (ASRA), a research organization joined by 14 Japanese car and semiconductor companies, recently received funding from Japan's New Energy and Industrial Technology Development Organization (NEDO). The money will facilitate the development of next-generation automotive SoC using chiplet technology.
